Bangalore: izmo Microsystems Private Limited (“izmomicro”), the semiconductor division of NSE-listed izmo Limited (NSE: IZMO), today announced a Memorandum of Understanding (MoU) with CCRAFT SA, a Swiss thin-film lithium niobate (TFLN) photonic chip foundry, and Alcyon Photonics SL, a Madrid-based leader in integrated
photonics IP design. The tri-party collaboration establishes a framework for jointly designing, producing, and commercialising advanced photonic integrated circuit (PIC) solutions for the datacom, telecom, aerospace, and sensor markets.
The partnership unites three specialised entities across the photonics value chain. CCRAFT, spun out of CSEM (the Swiss Centre for Electronics and Microtechnology), operates an ISO certified 150 mm wafer foundry and is among a select few companies globally manufacturing TFLN photonic chips at scale — enabling electro-optic modulators exceeding 400 Gbit/s.
Alcyon Photonics delivers validated, fabrication-ready photonic IP designs with proven architecture libraries, accelerating the path from prototype to volume production.
izmomicro brings to the collaboration its advanced semiconductor packaging and co packaged optics capabilities — the essential “last mile” of photonics commercialisation. The company recently achieved a significant breakthrough in silicon photonics packaging, becoming the first Indian company to demonstrate end-to-end silicon photonics packaging capability spanning design, simulation, optical alignment, fibre-attach, hermetic sealing, and
full system-level testing. Operating from a Class 1000 cleanroom in Bangalore with 3D die stacking, flip-chip assembly, fine-pitch wire bonding, and co-packaged optics capabilities, izmomicro’s packaging infrastructure is critical for translating photonic chip designs into production-ready systems — a capability in high demand globally but scarce, positioning India as a credible participant in the global silicon photonics supply chain.
Dinanath Soni, Director, izmo Microsystems Private Limited, said: “Silicon photonics is the critical infrastructure layer that will determine how effectively the world deploys AI and scales next-generation communication networks. By combining CCRAFT’s world-class TFLN foundry capabilities and Alcyon’s proven IP design expertise with our advanced packaging infrastructure in India, we are creating a genuinely
differentiated end-to-end photonics value chain. This collaboration deepens our engagement with Europe’s premier photonics ecosystem and positions us to address exciting commercial opportunities across datacom, telecom, aerospace, and quantum technologies.”
Silicon photonics has emerged as critical infrastructure for the AI-driven economy. According to industry research reports, the global silicon photonics market was valued at approximately USD 2–3 billion in 2025 and is projected to grow at a CAGR of 25–30%, with the total addressable market estimated at USD 10–22 billion by the early 2030s and potentially exceeding USD 28 billion by 2034. Data centres and high-performance computing account for over 70% of demand, with optical transceivers at 400G, 800G, and 1.6T becoming the standard as copper-based interconnects reach their physical limits. Silicon photonics is simultaneously powering advances in 5G/6G, quantum computing, LiDAR, and satellite communications. TFLN has attracted particular attention for its superior modulation bandwidth, lower drive voltage, and broad wavelength range — making it the preferred platform for next-generation AI interconnects and quantum photonics.
Under the MoU, the three companies will collaborate on delivering Alcyon’s photonic IP libraries to customers, joint design and production of photonic systems, and commercialisation of jointly developed solutions. izmomicro has been designated as a preferred packaging partner and will provide design guidelines to optimise photonic integrated circuits for advanced packaging from the outset.
The partnership positions izmomicro within Europe’s advanced photonics ecosystem, where the European Chips Act has made photonics a strategic priority. By partnering with CCRAFT in Switzerland and Alcyon in Spain, izmomicro establishes an India-Europe technology bridge combining India’s semiconductor packaging infrastructure with Europe’s chip design and foundry leadership — the model envisioned under India’s Aatmanirbhar Bharat
semiconductor initiative.
